Wave Soldering Machine – 200 SC (Carrier Type) Overview The Wave Soldering Machine – 200 SC (Carrier Type) is a high-performance single-wave soldering system for PCB mass production. It delivers reliable soldering for through-hole and selective SMD components with consistent joints, high throughput, and minimal defects. With precise temperature control, robust conveyors, and titanium alloy solder pot, it supports lead-free processes. Ideal for automotive, consumer, telecom, industrial, and medical electronics. Benefits High Productivity: Faster throughput, reduced cycle times. Consistent Quality: Defect-free joints, less human error. Lead-Free Ready: Durable titanium solder pot. Key Features Single-Wave Tech: Reduces bridging/skips, ensures coverage. PLC + HMI: Real-time monitoring, easy digital control. PID + SSR Heating: Stable solder bath & preheaters, energy efficient. Automatic Conveyor (200 mm): Smooth vibration-free PCB transport. Foam Fluxer: 2–10 µm candle with auto economy mode. Titanium Solder Pot (215 kg, 300°C): Corrosion-resistant, long life. Ceramic Preheater (800 mm): Even heating, insulated for efficiency. 2 Air Fans Cooling: Prevents cracks, ensures durability. Finger Cleaning System: Keeps contact clean, prevents contamination. Pneumatic Control: Pressure gauge + solenoid valve for precise flux spraying. Main Parts Solder Bath: Steel, SMT/Lambda nozzles, PID + PLC control, reduced dross. Pre-Heater: 800 mm ceramic zone, even heating, PID stable. Fluxer & Knife: ROHS-compliant, economy mode, independent control. Conveyor: Chain type, aluminium, AC motor + VFD. PCB Carrier: Aluminium with steel/titanium fingers, adjustable. Control Panel: PLC + HMI, VFD motors, MCBs & relays. Pneumatic System: Gauge + solenoid valve for air/flux control. Process Parameters Preheating: Up to 85°C to avoid thermal shock. Wetting Time: Strong solder-pad adhesion. Dwell Time: 2–4 s for reliable joints. Soldering Time: 5–10 s defect-free soldering. Cooling: Forced-air prevents cracks & stress. Applications PCB Lines: Reliable soldering at scale. Consumer: TVs, gadgets, appliances. Automotive: ECUs, dashboards, sensors. Industrial: Power boards, automation systems. Telecom: Routers, switches, modules. Medical: Diagnostic & precision devices. Advantages Optimized speed for mass production. Defect-free, consistent solder joints. Low energy costs with PID heating. Long-life solder pot (steel/titanium). User-friendly PLC + HMI interface. Reduced downtime & maintenance. Supports varied PCB sizes/components. Ensures durable, high-reliability joints.
| Model | WSM 200 SC |
| Air Pressure | 40 PSI |
| Air Consumption | 4.0 cfm (30 PSI) |
| solder pot capacity | 215 Kg |
| Solder Bath Power | 6 KW |
| solder pot temperature | Up to 300℃ |
| Solder Pot Material | Special Steel high grade |
| Solder Pot style | Mechanical Motor drive |
| Conveyor Angle | 4°–8° |
| Finger | Special Steel with hook (Optional: Titanium Finger) |
| Conveyor Height | 750+/-20 (mm) |
| Conveyor Speed | Max 2.5 m/min (Normal 0.8 mtr/min) |
| PCB Width | 60 -250mm |
| Warm-up Time | 15 min (150°C setting) |
| Pre Heater Power | 1.8 KW |
| Preheating Zones / Length | 800 mm |
| Control Mode | PID SSR |
| Preheating Method | Heating Element |
| Flux Bath capacity | 4 Ltr. |
| Foam Height | 10 mm |
| Foam width | 14 mm |
| Candle Pipe | 2-10 micron |
| Dimensions | 2800 X 1200 X 1000 mm |
| Weight | 280 Kg |
| Power Supply | 440V AC, 50Hz, 3 Phase, 5 wires |
| Control System | Touch Screen + PLC |
| Construction | Table Top |
| Operating Power | 4 kW |
| Start-up Power | 8 kW |
| Wave Height | 0-8 mm |
| Wave Width | 220 mm |
| Wave Type | Single Wave Carrier Type |