Faridabad
08048035042
+919910059135
Wave Soldering Machines by Estovir Technologies

Wave Soldering Machine – WSM 350 DC (Carrier Types)

INR 640000
Phone Number

08048035042

Please keep 0 before dialling the number.

Email Address info@estovir.in

Mon-Thu: 10 AM - 2 PM • Fri: 3 PM - 7AM

Other Website Visit our other website
Address Plot No. 68-69-89, HSIIDC Industrial Estate, Sector-59

Faridabad, India, 121004

Description

Wave Soldering Machine – WSM 350 DC (Carrier Type) Advanced Dual-Wave Solution for High-Quality PCB Assembly | Estovir Technologies The Wave Soldering Machine – WSM 350 DC (Carrier Type) is a next-generation solution for modern PCB assembly lines, engineered to deliver unmatched productivity, reliability, and precision. Designed for mass PCB soldering production, it offers consistent solder joints, reduced defects, and maximum throughput, making it a trusted choice across automotive, consumer electronics, telecom, industrial equipment, and medical electronics manufacturing. Overview Wave soldering is a proven process where a PCB passes over a continuous wave of molten solder, forming strong, defect-free electrical and mechanical connections. The WSM 350 DC automates this method with dual-wave soldering, advanced PLC control, and efficient preheating, eliminating errors common in manual soldering. By integrating lead-free compatibility, robust conveyors, and intelligent control systems, it ensures faster cycle times, energy efficiency, and superior long-term performance. Key Features Dual-Wave Soldering Technology – Reduces bridging and solder skips, ensuring defect-free solder joints for dense PCBs. Advanced PLC + HMI Touchscreen Control – Real-time monitoring, easy adjustments, and digital control over conveyor speed, solder wave height, and temperature. Energy-Efficient Heating – PID + SSR controlled preheating delivers stable soldering temperatures while minimizing energy costs. Automatic Carrier Conveyor – Adjustable width system supports PCBs up to 340 mm, offering smooth, vibration-free transport. High-Performance Foam Fluxer – Precise 2–5 micron flux application with economy mode, lowering solvent and flux usage. Titanium Alloy Solder Pot – Lead-free compatible, corrosion-resistant, and long-lasting with reliable solder capacity. Efficient Ceramic Glass Preheating – Prevents thermal shock, improves soldering quality, and reduces power loss. Dual Cooling Fans – Ensures proper solder joint solidification, preventing cracks and extending PCB reliability. Integrated Cleaning & Pneumatic System – Finger cleaning unit plus precision air pressure control for consistent, contamination-free soldering. Main Components Solder Bath – Special steel or titanium construction with dual nozzles and economy mode to minimize dross. Pre-Heater – Ceramic glass heating zone with uniform distribution and thermal insulation for energy savings. Fluxing System – High-precision foam fluxer with optional spray fluxing for maximum process control. Conveyor & Carrier – Chain-driven, heat-resistant, and adjustable for different PCB sizes and component profiles. Cooling Fans – Rapid cooling to stabilize solder joints immediately after wave contact. Control Panel – PLC + HMI touchscreen with digital controls for wave height, motor speed, and solder pump. Pneumatic System – Pressure gauge and solenoid valves regulate air for fluxing and solder leveling processes. Applications PCB Assembly Lines – High-speed mass production with reliable soldering. Consumer Electronics – TVs, radios, smartphones, and home appliances. Automotive Electronics – Dashboards, ECUs, and sensor modules requiring long-term reliability. Industrial Automation – Controllers, power supplies, and industrial boards. Telecom Devices – Routers, switches, and networking modules. Medical Electronics – Diagnostic systems and precision healthcare devices. Advantages High-Speed Production – Optimized for large-scale PCB assembly. Defect-Free Joints – Dual-wave technology ensures bridging-free results. Energy Efficient – Smart heating cuts operational costs. Durability – Long-lasting solder pot and robust machine design. User-Friendly – Touchscreen control with simple operation. Low Maintenance – Reliable components minimize downtime. Flexible PCB Handling – Adjustable carrier system supports varied board sizes. Lead-Free Ready – Meets RoHS and modern compliance standards. Standard Accessories (Included) Operation software Heating unit Fingers (10 pcs) Chain lock Fuse & relays Solid state relay Air control valve K-type thermocouple User manual Tool case set Why Choose Estovir Technologies? With years of expertise in electronics manufacturing equipment, Estovir Technologies provides cutting-edge wave soldering solutions, backed by fast delivery, reliable service, and long-term support. The WSM 350 DC ensures efficiency, quality, and durability, making it the perfect partner for modern PCB manufacturing. Wave Soldering Machine, Dual-Wave Soldering, PCB Assembly Equipment, Automatic Wave Soldering, Lead-Free PCB Soldering Machine, High-Speed PCB Manufacturing, SMT and Through-Hole Soldering

Specifications

Model WSM 350 DC
Conveyor Angle 4°–8°
Finger Special Steel wiith hook (Optional: Tiitanium Finger)
Conveyor Height 750+/-20 (mm)
Conveyor Speed Max 2.5 m/min (Normal 0.8 mtr/min)
PCB Width 60 -350mm
Flux Bath capacity 4 Ltr.
Foam Height 10 mm
Foam width 14 mm
Candle Pipe 2-5 micron
Wave Type Dual Wave Carrier Type
Candle Pipe 2-5 micron
Foam width 14 mm
Foam Height 10 mm
Flux Bath capacity 4 Ltr.
Control System Touch Screen + PLC
Power Supply 440V AC, 50Hz, 3 Phase, 5 wires
Weight 520 Kg
Dimensions 3350 × 1280 × 1750 mm
Preheating Method Heating Element
Control Mode PID SSR
Preheating Zones / Length 1200 mm
Pre Heater Power 3.6 KW
Warm-up Time 15 min (150°C setting)
Foam Height 10 mm
Foam width 14 mm
Candle Pipe 2-5 micron
Cooling System 2 Air Fan cooling
Operating Power 7 kW
Start-up Power 14 kW
Wave Height 0-8 mm
Wave Width 360 mm
Wave Type Dual Wave Carrier Type
Candle Pipe 2-5 micron
Foam width 14 mm
Foam Height 10 mm
Flux Bath capacity 4 Ltr.
PCB Width 60 -350mm
Conveyor Speed Max 2.5 m/min (Normal 0.8 mtr/min)
Conveyor Height 750+/-20 (mm)
Finger Special Steel wiith hook (Optional: Tiitanium Finger)
Conveyor Angle 4°–8°
Wave Width 360 mm
Wave Height 0-8 mm
Start-up Power 14 kW
Operating Power 7 kW
Cooling System 2 Air Fan cooling
Candle Pipe 2-5 micron
Foam width 14 mm
Foam Height 10 mm
Warm-up Time 15 min (150°C setting)
Pre Heater Power 3.6 KW
Preheating Zones / Length 1200 mm
Control Mode PID SSR
Preheating Method Heating Element
Dimensions 3350 × 1280 × 1750 mm
Weight 520 Kg
Power Supply 440V AC, 50Hz, 3 Phase, 5 wires
Control System Touch Screen + PLC
Flux Bath capacity 4 Ltr.
Foam Height 10 mm
Foam width 14 mm
Candle Pipe 2-5 micron
Flux Bath capacity 4 Ltr.
Control System Touch Screen + PLC
Power Supply 440V AC, 50Hz, 3 Phase, 5 wires
Weight 520 Kg
Dimensions 3350 × 1280 × 1750 mm
Preheating Method Heating Element
Control Mode PID SSR
Air Pressure 40 PSI
Air Consumption 4.0 cfm (30 PSI)
solder pot capacity 260 Kg
Solder Bath Power 8.2 KW
solder pot temperature Up to 300℃
Solder Pot Material Special Steel high grade
Solder Pot style Mechanical Motor drive
Warm-up Time 15 min (150°C setting)
Pre Heater Power 3.6 KW
Preheating Zones / Length 1200 mm
Control Mode PID SSR
Preheating Method Heating Element
Dimensions 3350 × 1280 × 1750 mm
Weight 520 Kg
Power Supply 440V AC, 50Hz, 3 Phase, 5 wires
Control System Touch Screen + PLC
Flux Bath capacity 4 Ltr.
Candle Pipe 2-5 micron
Foam width 14 mm
Foam Height 10 mm
Flux Bath capacity 4 Ltr.
Control System Touch Screen + PLC
Power Supply 440V AC, 50Hz, 3 Phase, 5 wires
Weight 520 Kg
Dimensions 3350 × 1280 × 1750 mm
Preheating Method Heating Element
Control Mode PID SSR
Preheating Zones / Length 1200 mm
Pre Heater Power 3.6 KW
Warm-up Time 15 min (150°C setting)
Foam Height 10 mm
Foam width 14 mm
Candle Pipe 2-5 micron
Cooling System 2 Air Fan cooling
Operating Power 7 kW
Start-up Power 14 kW
Wave Height 0-8 mm
Wave Width 360 mm
Conveyor Angle 4°–8°
Finger Special Steel wiith hook (Optional: Tiitanium Finger)
Conveyor Height 750+/-20 (mm)
Conveyor Speed Max 2.5 m/min (Normal 0.8 mtr/min)
PCB Width 60 -350mm
Flux Bath capacity 4 Ltr.
Foam Height 10 mm
Foam width 14 mm
Candle Pipe 2-5 micron
Wave Type Dual Wave Carrier Type
Wave Width 360 mm
Wave Height 0-8 mm
Start-up Power 14 kW
Operating Power 7 kW
Cooling System 2 Air Fan cooling
Candle Pipe 2-5 micron
Foam width 14 mm
Foam Height 10 mm
Warm-up Time 15 min (150°C setting)
Pre Heater Power 3.6 KW
Preheating Zones / Length 1200 mm
Control Mode PID SSR
Preheating Method Heating Element
Dimensions 3350 × 1280 × 1750 mm
Weight 520 Kg
Power Supply 440V AC, 50Hz, 3 Phase, 5 wires
Control System Touch Screen + PLC
Flux Bath capacity 4 Ltr.
Foam Height 10 mm
Foam width 14 mm
Candle Pipe 2-5 micron
Preheating Zones / Length 1200 mm
Pre Heater Power 3.6 KW
Warm-up Time 15 min (150°C setting)
Solder Pot style Mechanical Motor drive
Solder Pot Material Special Steel high grade
solder pot temperature Up to 300℃
Solder Bath Power 8.2 KW
solder pot capacity 260 Kg
Air Consumption 4.0 cfm (30 PSI)
Air Pressure 40 PSI