Description
Wave Soldering Machine – WSM 350 DC (Carrier Type)
Advanced Dual-Wave Solution for High-Quality PCB Assembly | Estovir Technologies
The Wave Soldering Machine – WSM 350 DC (Carrier Type) is a next-generation solution for modern PCB assembly lines, engineered to deliver unmatched productivity, reliability, and precision. Designed for mass PCB soldering production, it offers consistent solder joints, reduced defects, and maximum throughput, making it a trusted choice across automotive, consumer electronics, telecom, industrial equipment, and medical electronics manufacturing.
Overview
Wave soldering is a proven process where a PCB passes over a continuous wave of molten solder, forming strong, defect-free electrical and mechanical connections. The WSM 350 DC automates this method with dual-wave soldering, advanced PLC control, and efficient preheating, eliminating errors common in manual soldering. By integrating lead-free compatibility, robust conveyors, and intelligent control systems, it ensures faster cycle times, energy efficiency, and superior long-term performance.
Key Features
Dual-Wave Soldering Technology – Reduces bridging and solder skips, ensuring defect-free solder joints for dense PCBs.
Advanced PLC + HMI Touchscreen Control – Real-time monitoring, easy adjustments, and digital control over conveyor speed, solder wave height, and temperature.
Energy-Efficient Heating – PID + SSR controlled preheating delivers stable soldering temperatures while minimizing energy costs.
Automatic Carrier Conveyor – Adjustable width system supports PCBs up to 340 mm, offering smooth, vibration-free transport.
High-Performance Foam Fluxer – Precise 2–5 micron flux application with economy mode, lowering solvent and flux usage.
Titanium Alloy Solder Pot – Lead-free compatible, corrosion-resistant, and long-lasting with reliable solder capacity.
Efficient Ceramic Glass Preheating – Prevents thermal shock, improves soldering quality, and reduces power loss.
Dual Cooling Fans – Ensures proper solder joint solidification, preventing cracks and extending PCB reliability.
Integrated Cleaning & Pneumatic System – Finger cleaning unit plus precision air pressure control for consistent, contamination-free soldering.
Main Components
Solder Bath – Special steel or titanium construction with dual nozzles and economy mode to minimize dross.
Pre-Heater – Ceramic glass heating zone with uniform distribution and thermal insulation for energy savings.
Fluxing System – High-precision foam fluxer with optional spray fluxing for maximum process control.
Conveyor & Carrier – Chain-driven, heat-resistant, and adjustable for different PCB sizes and component profiles.
Cooling Fans – Rapid cooling to stabilize solder joints immediately after wave contact.
Control Panel – PLC + HMI touchscreen with digital controls for wave height, motor speed, and solder pump.
Pneumatic System – Pressure gauge and solenoid valves regulate air for fluxing and solder leveling processes.
Applications
PCB Assembly Lines – High-speed mass production with reliable soldering.
Consumer Electronics – TVs, radios, smartphones, and home appliances.
Automotive Electronics – Dashboards, ECUs, and sensor modules requiring long-term reliability.
Industrial Automation – Controllers, power supplies, and industrial boards.
Telecom Devices – Routers, switches, and networking modules.
Medical Electronics – Diagnostic systems and precision healthcare devices.
Advantages
High-Speed Production – Optimized for large-scale PCB assembly.
Defect-Free Joints – Dual-wave technology ensures bridging-free results.
Energy Efficient – Smart heating cuts operational costs.
Durability – Long-lasting solder pot and robust machine design.
User-Friendly – Touchscreen control with simple operation.
Low Maintenance – Reliable components minimize downtime.
Flexible PCB Handling – Adjustable carrier system supports varied board sizes.
Lead-Free Ready – Meets RoHS and modern compliance standards.
Standard Accessories (Included)
Operation software
Heating unit
Fingers (10 pcs)
Chain lock
Fuse & relays
Solid state relay
Air control valve
K-type thermocouple
User manual
Tool case set
Why Choose Estovir Technologies?
With years of expertise in electronics manufacturing equipment, Estovir Technologies provides cutting-edge wave soldering solutions, backed by fast delivery, reliable service, and long-term support. The WSM 350 DC ensures efficiency, quality, and durability, making it the perfect partner for modern PCB manufacturing.
Wave Soldering Machine, Dual-Wave Soldering, PCB Assembly Equipment, Automatic Wave Soldering, Lead-Free PCB Soldering Machine, High-Speed PCB Manufacturing, SMT and Through-Hole Soldering
Specifications
| Model | WSM 350 DC |
|---|---|
| Air Pressure | 40 PSI |
| Solder Bath Power | 8.2 KW |
| solder pot capacity | 260 Kg |
| Air Consumption | 4.0 cfm (30 PSI) |
| solder pot temperature | Up to 300℃ |
| Warm-up Time | 15 min (150°C setting) |
| Pre Heater Power | 3.6 KW |
| Solder Pot style | Mechanical Motor drive |
| Preheating Zones / Length | 1200 mm |
| Solder Pot Material | Special Steel high grade |
| Flux Bath capacity | 4 Ltr. |
| Foam width | 14 mm |
| Candle Pipe | 2-5 micron |
| Foam Height | 10 mm |
| Control System | Touch Screen + PLC |
| Control Mode | PID SSR |
| Dimensions | 3350 × 1280 × 1750 mm |
| Power Supply | 440V AC, 50Hz, 3 Phase, 5 wires |
| Preheating Zones / Length | 1200 mm |
| Preheating Method | Heating Element |
| Weight | 520 Kg |
| Pre Heater Power | 3.6 KW |
| Warm-up Time | 15 min (150°C setting) |
| Conveyor Speed | Max 2.5 m/min (Normal 0.8 mtr/min) |
| Foam width | 14 mm |
| Operating Power | 7 kW |
| Foam width | 14 mm |
| Start-up Power | 14 kW |
| Candle Pipe | 2-5 micron |
| Foam Height | 10 mm |
| Conveyor Height | 750+/-20 (mm) |
| Wave Type | Dual Wave Carrier Type |
| Wave Width | 360 mm |
| Conveyor Angle | 4°–8° |
| PCB Width | 60 -350mm |
| Candle Pipe | 2-5 micron |
| Cooling System | 2 Air Fan cooling |
| Wave Height | 0-8 mm |
| Foam Height | 10 mm |
| Flux Bath capacity | 4 Ltr. |
| Finger | Special Steel wiith hook (Optional: Tiitanium Finger) |
| solder pot capacity | 260 Kg |
| Cooling System | 2 Air Fan cooling |
| Wave Height | 0-8 mm |
| Start-up Power | 14 kW |
| Control System | Touch Screen + PLC |
| Solder Pot style | Mechanical Motor drive |
| Warm-up Time | 15 min (150°C setting) |
| Operating Power | 7 kW |
| Wave Width | 360 mm |
| Power Supply | 440V AC, 50Hz, 3 Phase, 5 wires |
| Foam Height | 10 mm |
| Foam width | 14 mm |
| Dimensions | 3350 × 1280 × 1750 mm |
| Candle Pipe | 2-5 micron |
| Air Consumption | 4.0 cfm (30 PSI) |
| Control Mode | PID SSR |
| Warm-up Time | 15 min (150°C setting) |
| Solder Bath Power | 8.2 KW |
| Pre Heater Power | 3.6 KW |
| Foam width | 14 mm |
| Air Pressure | 40 PSI |
| Control Mode | PID SSR |
| Weight | 520 Kg |
| Preheating Zones / Length | 1200 mm |
| Dimensions | 3350 × 1280 × 1750 mm |
| Weight | 520 Kg |
| Control System | Touch Screen + PLC |
| Preheating Method | Heating Element |
| Power Supply | 440V AC, 50Hz, 3 Phase, 5 wires |
| Flux Bath capacity | 4 Ltr. |
| Solder Pot Material | Special Steel high grade |
| Preheating Method | Heating Element |
| Pre Heater Power | 3.6 KW |
| Flux Bath capacity | 4 Ltr. |
| Preheating Zones / Length | 1200 mm |
| Candle Pipe | 2-5 micron |
| Foam Height | 10 mm |
| solder pot temperature | Up to 300℃ |
| Candle Pipe | 2-5 micron |
| Control Mode | PID SSR |
| Preheating Method | Heating Element |
| Conveyor Speed | Max 2.5 m/min (Normal 0.8 mtr/min) |
| Wave Width | 360 mm |
| Conveyor Angle | 4°–8° |
| Start-up Power | 14 kW |
| Power Supply | 440V AC, 50Hz, 3 Phase, 5 wires |
| Control System | Touch Screen + PLC |
| Dimensions | 3350 × 1280 × 1750 mm |
| Foam Height | 10 mm |
| Warm-up Time | 15 min (150°C setting) |
| Wave Type | Dual Wave Carrier Type |
| Preheating Zones / Length | 1200 mm |
| Foam width | 14 mm |
| Flux Bath capacity | 4 Ltr. |
| Wave Height | 0-8 mm |
| Foam width | 14 mm |
| Power Supply | 440V AC, 50Hz, 3 Phase, 5 wires |
| Foam Height | 10 mm |
| Candle Pipe | 2-5 micron |
| Control System | Touch Screen + PLC |
| Weight | 520 Kg |
| Warm-up Time | 15 min (150°C setting) |
| Foam width | 14 mm |
| Flux Bath capacity | 4 Ltr. |
| Flux Bath capacity | 4 Ltr. |
| Cooling System | 2 Air Fan cooling |
| PCB Width | 60 -350mm |
| Preheating Zones / Length | 1200 mm |
| Operating Power | 7 kW |
| Finger | Special Steel wiith hook (Optional: Tiitanium Finger) |
| Control Mode | PID SSR |
| Foam width | 14 mm |
| Foam Height | 10 mm |
| Foam Height | 10 mm |
| Pre Heater Power | 3.6 KW |
| Foam width | 14 mm |
| Wave Width | 360 mm |
| Wave Height | 0-8 mm |
| Operating Power | 7 kW |
| Control System | Touch Screen + PLC |
| Dimensions | 3350 × 1280 × 1750 mm |
| Weight | 520 Kg |
| Preheating Method | Heating Element |
| Candle Pipe | 2-5 micron |
| Foam Height | 10 mm |
| Wave Type | Dual Wave Carrier Type |
| Dimensions | 3350 × 1280 × 1750 mm |
| Control Mode | PID SSR |
| Conveyor Height | 750+/-20 (mm) |
| Candle Pipe | 2-5 micron |
| Pre Heater Power | 3.6 KW |
| Foam Height | 10 mm |
| Start-up Power | 14 kW |
| Candle Pipe | 2-5 micron |
| Preheating Method | Heating Element |
| Weight | 520 Kg |
| Cooling System | 2 Air Fan cooling |
| Flux Bath capacity | 4 Ltr. |
| Candle Pipe | 2-5 micron |
| Flux Bath capacity | 4 Ltr. |
| Power Supply | 440V AC, 50Hz, 3 Phase, 5 wires |
| Foam width | 14 mm |
| Conveyor Speed | Max 2.5 m/min (Normal 0.8 mtr/min) |
| PCB Width | 60 -350mm |
| Finger | Special Steel wiith hook (Optional: Tiitanium Finger) |
| Conveyor Angle | 4°–8° |
| Conveyor Height | 750+/-20 (mm) |
