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Wave Soldering Machine – WSM 350 DC (Carrier Type) Advanced Dual-Wave Solution for High-Quality PCB Assembly | Estovir Technologies The Wave Soldering Machine – WSM 350 DC (Carrier Type) is a next-generation solution for modern PCB assembly lines, engineered to deliver unmatched productivity, reliability, and precision. Designed for mass PCB soldering production, it offers consistent solder joints, reduced defects, and maximum throughput, making it a trusted choice across automotive, consumer electronics, telecom, industrial equipment, and medical electronics manufacturing. Overview Wave soldering is a proven process where a PCB passes over a continuous wave of molten solder, forming strong, defect-free electrical and mechanical connections. The WSM 350 DC automates this method with dual-wave soldering, advanced PLC control, and efficient preheating, eliminating errors common in manual soldering. By integrating lead-free compatibility, robust conveyors, and intelligent control systems, it ensures faster cycle times, energy efficiency, and superior long-term performance. Key Features Dual-Wave Soldering Technology – Reduces bridging and solder skips, ensuring defect-free solder joints for dense PCBs. Advanced PLC + HMI Touchscreen Control – Real-time monitoring, easy adjustments, and digital control over conveyor speed, solder wave height, and temperature. Energy-Efficient Heating – PID + SSR controlled preheating delivers stable soldering temperatures while minimizing energy costs. Automatic Carrier Conveyor – Adjustable width system supports PCBs up to 340 mm, offering smooth, vibration-free transport. High-Performance Foam Fluxer – Precise 2–5 micron flux application with economy mode, lowering solvent and flux usage. Titanium Alloy Solder Pot – Lead-free compatible, corrosion-resistant, and long-lasting with reliable solder capacity. Efficient Ceramic Glass Preheating – Prevents thermal shock, improves soldering quality, and reduces power loss. Dual Cooling Fans – Ensures proper solder joint solidification, preventing cracks and extending PCB reliability. Integrated Cleaning & Pneumatic System – Finger cleaning unit plus precision air pressure control for consistent, contamination-free soldering. Main Components Solder Bath – Special steel or titanium construction with dual nozzles and economy mode to minimize dross. Pre-Heater – Ceramic glass heating zone with uniform distribution and thermal insulation for energy savings. Fluxing System – High-precision foam fluxer with optional spray fluxing for maximum process control. Conveyor & Carrier – Chain-driven, heat-resistant, and adjustable for different PCB sizes and component profiles. Cooling Fans – Rapid cooling to stabilize solder joints immediately after wave contact. Control Panel – PLC + HMI touchscreen with digital controls for wave height, motor speed, and solder pump. Pneumatic System – Pressure gauge and solenoid valves regulate air for fluxing and solder leveling processes. Applications PCB Assembly Lines – High-speed mass production with reliable soldering. Consumer Electronics – TVs, radios, smartphones, and home appliances. Automotive Electronics – Dashboards, ECUs, and sensor modules requiring long-term reliability. Industrial Automation – Controllers, power supplies, and industrial boards. Telecom Devices – Routers, switches, and networking modules. Medical Electronics – Diagnostic systems and precision healthcare devices. Advantages High-Speed Production – Optimized for large-scale PCB assembly. Defect-Free Joints – Dual-wave technology ensures bridging-free results. Energy Efficient – Smart heating cuts operational costs. Durability – Long-lasting solder pot and robust machine design. User-Friendly – Touchscreen control with simple operation. Low Maintenance – Reliable components minimize downtime. Flexible PCB Handling – Adjustable carrier system supports varied board sizes. Lead-Free Ready – Meets RoHS and modern compliance standards. Standard Accessories (Included) Operation software Heating unit Fingers (10 pcs) Chain lock Fuse & relays Solid state relay Air control valve K-type thermocouple User manual Tool case set Why Choose Estovir Technologies? With years of expertise in electronics manufacturing equipment, Estovir Technologies provides cutting-edge wave soldering solutions, backed by fast delivery, reliable service, and long-term support. The WSM 350 DC ensures efficiency, quality, and durability, making it the perfect partner for modern PCB manufacturing. Wave Soldering Machine, Dual-Wave Soldering, PCB Assembly Equipment, Automatic Wave Soldering, Lead-Free PCB Soldering Machine, High-Speed PCB Manufacturing, SMT and Through-Hole Soldering

Wave Soldering Machine WSM 300D FEATURES :- GENERAL-  Available in Lead Free Version  Choice of Single or Dual Wave  Independent Controllers  Power Efficient Design Solder Bath –  High Grade Rohs Solder Pot  Solder pump driven by AC 3 ø Motor  Wave Height Control through VFD  PID controller for accurate temperature control  Interval sensor with Digital Timer PRE-HEATER-  Ceramic Glass top for high efficiency IR transfer  PID controller for 2 stage accurate temperature control FOAM FLUXER WITH AIR KNIFE-  High Grade construction with air knife  Special 2-micron Foaming Tube  Interval sensor with Digital Timer  Fitted with Air filter, regulator & indicator  External air supply required CONVEYOR-  Chain Type Conveyor  High Grade aluminium profile  Conveyor driven by AC 3 ø Motor  Conveyor speed Control through VFD  Step less angle adjustment

We are well established in the industry as the foremost manufacturer and supplier of Solder Pot. Effective in functionality, these pots are specifically integrated for excellent tinning of components like wire ends, PCBs and leads. Our machines are technically assorted under the firm supervision of expert engineers. In addition, our respected customers can acquire the Solder Pot from us at competitive prices. Features: Reduces risk in soldering Convenient to operate Easy temperature adjustment Further Details: Meant for tinning of component leads, wire ends and PCB's Digital Temperature controller with Display Separate housings for solder Pot and controller MCB protection for short circuit and overload Pot Size Dimension mm Weight Power Solder Cap. Dia 4.0" 510 x 210 x 228 10 Kg. 220V, 50 Hz, 600W 10 Kg 4.0" x 4.0" 510 x 200 x 228 10 Kg 220V, 50 Hz, 600W 4 Kg. 6.0" x 6.0" 555 x 255 x 230 13 Kg 220V, 50Hz, 900W 8 Kg 8.0" x 8.0" 610 x 300 x 230 15 Kg 220V, 50Hz, 1200W 13 Kg. 10.0" x 10.0" 770 x 210 x 230 22 Kg. 220V, 50 Hz, 1400W 20 Kg.