'leadfree solder'

Wave Soldering Machine – WSM 350 DC (Carrier Type) Advanced Dual-Wave Solution for High-Quality PCB Assembly | Estovir Technologies The Wave Soldering Machine – WSM 350 DC (Carrier Type) is a next-generation solution for modern PCB assembly lines, engineered to deliver unmatched productivity, reliability, and precision. Designed for mass PCB soldering production, it offers consistent solder joints, reduced defects, and maximum throughput, making it a trusted choice across automotive, consumer electronics, telecom, industrial equipment, and medical electronics manufacturing. Overview Wave soldering is a proven process where a PCB passes over a continuous wave of molten solder, forming strong, defect-free electrical and mechanical connections. The WSM 350 DC automates this method with dual-wave soldering, advanced PLC control, and efficient preheating, eliminating errors common in manual soldering. By integrating lead-free compatibility, robust conveyors, and intelligent control systems, it ensures faster cycle times, energy efficiency, and superior long-term performance. Key Features Dual-Wave Soldering Technology – Reduces bridging and solder skips, ensuring defect-free solder joints for dense PCBs. Advanced PLC + HMI Touchscreen Control – Real-time monitoring, easy adjustments, and digital control over conveyor speed, solder wave height, and temperature. Energy-Efficient Heating – PID + SSR controlled preheating delivers stable soldering temperatures while minimizing energy costs. Automatic Carrier Conveyor – Adjustable width system supports PCBs up to 340 mm, offering smooth, vibration-free transport. High-Performance Foam Fluxer – Precise 2–5 micron flux application with economy mode, lowering solvent and flux usage. Titanium Alloy Solder Pot – Lead-free compatible, corrosion-resistant, and long-lasting with reliable solder capacity. Efficient Ceramic Glass Preheating – Prevents thermal shock, improves soldering quality, and reduces power loss. Dual Cooling Fans – Ensures proper solder joint solidification, preventing cracks and extending PCB reliability. Integrated Cleaning & Pneumatic System – Finger cleaning unit plus precision air pressure control for consistent, contamination-free soldering. Main Components Solder Bath – Special steel or titanium construction with dual nozzles and economy mode to minimize dross. Pre-Heater – Ceramic glass heating zone with uniform distribution and thermal insulation for energy savings. Fluxing System – High-precision foam fluxer with optional spray fluxing for maximum process control. Conveyor & Carrier – Chain-driven, heat-resistant, and adjustable for different PCB sizes and component profiles. Cooling Fans – Rapid cooling to stabilize solder joints immediately after wave contact. Control Panel – PLC + HMI touchscreen with digital controls for wave height, motor speed, and solder pump. Pneumatic System – Pressure gauge and solenoid valves regulate air for fluxing and solder leveling processes. Applications PCB Assembly Lines – High-speed mass production with reliable soldering. Consumer Electronics – TVs, radios, smartphones, and home appliances. Automotive Electronics – Dashboards, ECUs, and sensor modules requiring long-term reliability. Industrial Automation – Controllers, power supplies, and industrial boards. Telecom Devices – Routers, switches, and networking modules. Medical Electronics – Diagnostic systems and precision healthcare devices. Advantages High-Speed Production – Optimized for large-scale PCB assembly. Defect-Free Joints – Dual-wave technology ensures bridging-free results. Energy Efficient – Smart heating cuts operational costs. Durability – Long-lasting solder pot and robust machine design. User-Friendly – Touchscreen control with simple operation. Low Maintenance – Reliable components minimize downtime. Flexible PCB Handling – Adjustable carrier system supports varied board sizes. Lead-Free Ready – Meets RoHS and modern compliance standards. Standard Accessories (Included) Operation software Heating unit Fingers (10 pcs) Chain lock Fuse & relays Solid state relay Air control valve K-type thermocouple User manual Tool case set Why Choose Estovir Technologies? With years of expertise in electronics manufacturing equipment, Estovir Technologies provides cutting-edge wave soldering solutions, backed by fast delivery, reliable service, and long-term support. The WSM 350 DC ensures efficiency, quality, and durability, making it the perfect partner for modern PCB manufacturing. Wave Soldering Machine, Dual-Wave Soldering, PCB Assembly Equipment, Automatic Wave Soldering, Lead-Free PCB Soldering Machine, High-Speed PCB Manufacturing, SMT and Through-Hole Soldering

Solder Paste Mixer – ET 500 SPM by Estovir Technologies Overview Solder Paste Mixer – ET 500 SPM Estovir Technologies the Solder Paste Mixer – ET 500 SPM, engineered to deliver perfect solder paste consistency before SMT production. Featuring a 45° dual-rotation system, it ensures uniform mixing, bubble removal, and stable viscosity—guaranteeing defect-free soldering results. With its compact design, adjustable mixing time, and built-in safety mechanisms, this mixer is ideal for SMT lines, PCB assembly, and high-precision electronics manufacturing. Key Features of Solder Paste Mixer – ET 500 SPM Dual 45° Rotation System: Ensures uniform paste mixing, bubble removal, and natural viscosity recovery. Adjustable Mixing Time: Set from 01 sec to 99 hrs using a digital LED display. High Capacity: Supports up to 1000g (2 × 500g cans) with Φ60–Φ67 mm diameter. High-Speed Performance: 400 RPM revolution and 150–300 RPM rotation for fast and consistent results. Safe & Reliable: Mixes paste without opening the can lid, preventing contamination and spills. Stable & Low Noise: Designed for vibration-free, quiet operation on production floors. Compact & Durable: Space-saving 400 × 400 × 520 mm design with rugged build. Energy Efficient: Runs on AC 220V, 50Hz, consuming minimal power. Why Choose of Solder Paste Mixer – ET 500 SPM? The ET 500 SPM delivers consistency, speed, and safety—three essentials for SMT assembly. Unlike manual mixing, its automated dual-rotation system provides repeatable results, eliminating human error. It is compact yet powerful, designed for continuous industrial use with minimal maintenance. Whether for domestic or imported solder paste, it ensures your SMT line runs at peak efficiency. Improves soldering quality Reduces defects caused by poor paste consistency Increases throughput with quick 3–5 min mixing Designed for long-term, reliable industrial performance Applications of Solder Paste Mixer – ET 500 SPM The ET 500 SPM Solder Paste Mixer is designed to deliver precise, uniform, and bubble-free solder paste consistency—making it an essential machine for SMT assembly lines and electronics production environments. By ensuring consistent viscosity, it reduces defects in solder joints and improves overall product reliability. Its compact yet high-capacity design makes it suitable for a wide range of industries that require precision soldering and efficient PCB assembly. SMT (Surface Mount Technology) production lines PCB manufacturing & prototyping units Consumer electronics & LED assembly Automotive electronic component manufacturing Telecommunication & networking equipment assembly Industrial and defense electronics production

Automatic DIP Soldering Machine – 14″ X 18″ by Estovir Technologies Automatic DIP Soldering Machine – 14 X 18″ Estovir Technologies introduces a high-performance Automatic DIP Soldering Machine – 14″ X 14″ machine tailored for modern electronics manufacturing. With cutting-edge features and durable design, it ensures consistent soldering outcomes with minimal manual input. Whether you’re scaling production or refining prototypes, this machine delivers dependable results every time. Why Choose Estovir Automatic DIP Soldering Machine – 14″ X 18″ – Benefits You Can Count On Estovir’s Automatic DIP Soldering Machine – 14″ X 18″ is engineered to deliver efficiency, reliability, and long-term performance. It’s designed with the needs of high-speed electronics production in mind and guarantees consistent results across multiple batches. Here’s why it stands out: Superior Soldering Accuracy The system delivers precise and uniform solder joints, minimizing the risk of cold joints, solder bridges, or incomplete connections. Enhanced Productivity With reduced manual intervention and fast processing, it significantly increases production throughput for both small and large batch volumes. Optimized Energy Use Advanced thermal control and efficient power usage reduce overall operational costs without compromising performance. Labor Cost Reduction By automating soldering, the machine reduces dependence on manual labor, lowering staffing needs while maintaining high-quality output. Consistent Quality Across Batches Whether it’s your first PCB or the hundredth, every board is soldered with the same precision thanks to digital timing and temperature regulation. Low Maintenance, High Uptime Designed with durable parts and easy access panels, this machine ensures fewer breakdowns and quick servicing, boosting uptime. Eco-Conscious Design With efficient energy use and minimal solder waste, it supports sustainable production practices. Key Features of Automatic DIP Soldering Machine – 14″ X 18″ Each unit from Estovir Technologies integrates industry-leading innovations that simplify soldering tasks and enhance reliability: Digital Temperature Controller The solder bath is precisely maintained with a digital controller, ensuring consistent heat distribution and preventing thermal shock to components. This feature is crucial for sensitive or multi-layer PCBs. Electronic Dwell Timer Set and automate soldering time with pinpoint accuracy. This ensures that every component is exposed to the solder for the exact duration required, improving solder strength and reliability. Fast Heat-Up Time With heat-up times of just 35 minutes, the machine quickly reaches optimal temperature, reducing idle time and enabling faster job starts. Rugged Industrial Build Crafted from high-grade materials, the machine withstands long production hours in demanding factory environments, ensuring years of reliable performance. Mechanical Depth Adjustment Users can easily adjust the soldering depth to suit various PCB thicknesses. This helps accommodate diverse board layouts without needing different equipment. Multi-Board PCB Carrier The versatile PCB carrier allows multiple boards to be loaded at once, boosting efficiency in batch soldering without compromising quality. Compact Footprint Despite its powerful capabilities, the machine fits neatly in most workspaces, making it suitable even for smaller production units or labs. Low Operating Noise Designed for quiet operation, it maintains a safe and comfortable working environment for technicians and operators. Automatic DIP Soldering Machine – 14″ X 18″ Applications This solution is ideal for: Consumer electronics manufacturing LED lighting assemblies Automotive electronics Telecommunication equipment Power supply units R&D labs and prototyping centers No matter the scale, Estovir’s Automatic DIP Soldering Machine delivers uniform results across every application. Estovir Technologies presents the Automatic DIP Soldering Machine – 14″ X 18″– engineered for speed, accuracy, and consistency in mass PCB soldering. Our machine offers excellent thermal stability, precise temperature control, and an advanced PCB carrier system. With intuitive digital controls and robust safety mechanisms, it simplifies soldering tasks across production lines. Ideal for electronics manufacturers, repair centers, and prototyping units, it boosts throughput while reducing soldering defects. Get superior quality, less manual intervention, and optimized energy usage in every batch.

Automatic DIP Soldering Machine – 14″ X 14″ by Estovir Technologies Automatic DIP Soldering Machine – 14″ X 14″ Estovir Technologies introduces a high-performance Automatic DIP Soldering Machine – 14″ X 14″ machine tailored for modern electronics manufacturing. With cutting-edge features and durable design, it ensures consistent soldering outcomes with minimal manual input. Whether you’re scaling production or refining prototypes, this machine delivers dependable results every time. Why Choose Estovir Automatic DIP Soldering Machine – 14″ X 14″ – Benefits You Can Count On Estovir’s Automatic DIP Soldering Machine – 14″ X 14″ is engineered to deliver efficiency, reliability, and long-term performance. It’s designed with the needs of high-speed electronics production in mind and guarantees consistent results across multiple batches. Here’s why it stands out: Superior Soldering Accuracy The system delivers precise and uniform solder joints, minimizing the risk of cold joints, solder bridges, or incomplete connections. Enhanced Productivity With reduced manual intervention and fast processing, it significantly increases production throughput for both small and large batch volumes. Optimized Energy Use Advanced thermal control and efficient power usage reduce overall operational costs without compromising performance. Labor Cost Reduction By automating soldering, the machine reduces dependence on manual labor, lowering staffing needs while maintaining high-quality output. Consistent Quality Across Batches Whether it’s your first PCB or the hundredth, every board is soldered with the same precision thanks to digital timing and temperature regulation. Low Maintenance, High Uptime Designed with durable parts and easy access panels, this machine ensures fewer breakdowns and quick servicing, boosting uptime. Eco-Conscious Design With efficient energy use and minimal solder waste, it supports sustainable production practices. Key Features of Automatic DIP Soldering Machine – 14″ X 14″ Each unit from Estovir Technologies integrates industry-leading innovations that simplify soldering tasks and enhance reliability: Digital Temperature Controller The solder bath is precisely maintained with a digital controller, ensuring consistent heat distribution and preventing thermal shock to components. This feature is crucial for sensitive or multi-layer PCBs. Electronic Dwell Timer Set and automate soldering time with pinpoint accuracy. This ensures that every component is exposed to the solder for the exact duration required, improving solder strength and reliability. Fast Heat-Up Time With heat-up times of just 35 minutes, the machine quickly reaches optimal temperature, reducing idle time and enabling faster job starts. Rugged Industrial Build Crafted from high-grade materials, the machine withstands long production hours in demanding factory environments, ensuring years of reliable performance. Mechanical Depth Adjustment Users can easily adjust the soldering depth to suit various PCB thicknesses. This helps accommodate diverse board layouts without needing different equipment. Multi-Board PCB Carrier The versatile PCB carrier allows multiple boards to be loaded at once, boosting efficiency in batch soldering without compromising quality. Compact Footprint Despite its powerful capabilities, the machine fits neatly in most workspaces, making it suitable even for smaller production units or labs. Low Operating Noise Designed for quiet operation, it maintains a safe and comfortable working environment for technicians and operators. Automatic DIP Soldering Machine – 14″ X 14″ Applications This solution is ideal for: Consumer electronics manufacturing LED lighting assemblies Automotive electronics Telecommunication equipment Power supply units R&D labs and prototyping centers No matter the scale, Estovir’s Automatic DIP Soldering Machine delivers uniform results across every application. Estovir Technologies presents the Automatic DIP Soldering Machine – 14″ X 14″– engineered for speed, accuracy, and consistency in mass PCB soldering. Our machine offers excellent thermal stability, precise temperature control, and an advanced PCB carrier system. With intuitive digital controls and robust safety mechanisms, it simplifies soldering tasks across production lines. Ideal for electronics manufacturers, repair centers, and prototyping units, it boosts throughput while reducing soldering defects. Get superior quality, less manual intervention, and optimized energy usage in every batch.

Digital Display Lead-Free Soldering Station 60W The Digital Soldering Station 60W by Estovir Technologies ensures precision and efficiency in electronics repair and PCB assembly. Designed for durability and accuracy, it features advanced temperature control, rapid ceramic heating, and an easy-to-read LED display. Ideal for DIY electronics projects and professional use. Specifications: • Model: SS60W • Weight: 5 kg • Input Voltage: 220V AC ±10% 50Hz • Power Consumption: 60W (Max.) • Temperature Control Range: 150°C to 450°C (302°F to 842°F) • Output Voltage: 28V AC • Temperature Stability: ±1°C (Static) • Display: 7-Segment LED Display • Max. Surrounding Temperature: 40°C • Calibration Method: Digital Calibration • Calibration Temperature Range: 50°C to -50°C (122°F to -58°F) • Ground Impedance: < 2Ω • Ground Voltage: < 2mV • Heating Element: Ceramic Heating Core Product Features: • 7-Segment LED Display: Displays temperature clearly for easy monitoring. • Efficient Heating: Ceramic heating core ensures fast heat-up times and stable operation. • Precision Control: Uses PID power control and MCU-based temperature regulation for accuracy. • Durable Construction: High-temperature braided material enhances longevity and performance. • User-Friendly Display: Temperature shown in Celsius for operator convenience. • Rapid Calibration: Computerized Temperature Calibration corrects discrepancies quickly.

Description: The EMS 3040 MP Manual Solder Paste & Glue Printer is a high-precision, flexible solution designed for the application of solder paste and glue on various types of printed circuit boards (PCBs). It features a honeycomb base, similar to those found in semi-automatic solder paste printers, ensuring enhanced stability and precise operation. This printer supports both single and double-sided PCBs, making it versatile for a range of applications. The stencil movement mechanism is counterbalanced for smooth operation, and the printing platform is highly adjustable, with fine-tuned control over the X-axis, Y-axis, and theta angle for accurate positioning. Built with superior materials, the EMS 3040 MP is durable and designed to last in demanding environments. Specifications: • Base Type: Honeycomb base (similar to semi-automatic solder paste printers) • Adjustability: High precision and flexible adjustments for different board types • PCB Compatibility: Can process double-sided PCBs • Stencil Movement: Up and down with counterbalance • Platform Adjustments: Precise adjustments for X-axis, Y-axis, and theta angle • Material: Made of superior materials for durability • Dimensions: 560 x 390 x 350 mm • Platform Size: 300 x 400 mm • PCB Size: 250 x 350 mm • PCB Thickness: 0-100 mm • PCB Tuning Range: Front/Side ± 10 mm • Platform Height: 100 mm • Repeatability: ±0.01 mm for high precision printing • Positioning Mode: Side/Reference hole positioning for accurate placement • Weight: Approx. 30 kg • Category: SMT Machines (Surface Mount Technology) Key Features : • Precision: High precision solder paste and glue printing with repeatability of ±0.01 mm. • Adjustability: Fine adjustments in X-axis, Y-axis, and theta angle for flexible board handling. • Dual-Sided PCB Support: Capability to handle double-sided PCBs. • Durability: Constructed with superior materials for long-lasting performance. • Compact Design: Efficient design with a footprint of 560 x 390 x 350 mm. • Easy Setup: Simple and quick adjustments for different board sizes and configurations. • Counterbalance Stencil Movement: Ensures smooth and consistent stencil movement. • Precision Platform: Allows accurate tuning for optimal paste application. This machine is ideal for SMT manufacturing lines looking for a manual solder paste printer that combines high precision with flexibility for various PCB types and sizes.

Solder Paste Mixer EMS 500 SM • Unique contoured shape,generous appearance and practical which is made by advanced coating process workmanship. • Mixing principalis on the basis of motor rotation and revolution, no need to defrost the paste. Paste needs to berecovered in short time,then the solder can beusedafterstirnng well anddeforming. • Okay for allbrandsof 500 gm paste,mixingwith two cansat a time, making the process efficient. • Paste box does not need to be opened during stirring. This prevents oxidation and water vapour absorption. • Closed stirring can fix running time,ensure softness of paste,andstirringold andnew paste makes new active paste. • High degree of automation, stable performance, easy to operate, high safety factor and easy maintenance. • Applies to Omrontime relay controller, reliable andeasy to operate. Revolution speed 600 rpm Rotation speed 350 rpm Motor 1P AC 220 V 50/60 Hz,40 W Power 1P AC 220 V 50/60 Hz Mixing method Centrifugalmixing Mixing angle 45 (oblque) Mixing capacity Two cans 500 gm each Weight 40 kg approx. Dimensions 400x400x480 mmTlme0-9 hr

Wave Soldering Machine WSM 300D FEATURES :- GENERAL-  Available in Lead Free Version  Choice of Single or Dual Wave  Independent Controllers  Power Efficient Design Solder Bath –  High Grade Rohs Solder Pot  Solder pump driven by AC 3 ø Motor  Wave Height Control through VFD  PID controller for accurate temperature control  Interval sensor with Digital Timer PRE-HEATER-  Ceramic Glass top for high efficiency IR transfer  PID controller for 2 stage accurate temperature control FOAM FLUXER WITH AIR KNIFE-  High Grade construction with air knife  Special 2-micron Foaming Tube  Interval sensor with Digital Timer  Fitted with Air filter, regulator & indicator  External air supply required CONVEYOR-  Chain Type Conveyor  High Grade aluminium profile  Conveyor driven by AC 3 ø Motor  Conveyor speed Control through VFD  Step less angle adjustment

Nut Barrel For Soldering Station 60W Specifications for this item Brand Name - Generic Part Number - NB 60W Size - 60 Watt